Wafer Grinder Coolant Nozzle Manifold from Canada
Stainless steel manifold attachment with multiple nozzles that mounts on wafer grinders/lappers (8429) to deliver deionized water coolant precisely during semiconductor wafer surface preparation. 8431.49.9020.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document DI water purity requirements and flow rates per nozzle
• Photograph mounting interface matching specific grinder models
• General manifolds risk 8481 classification if pump-integrated