Semiconductor Wafer Edge Grinder Spindle from Japan
High-precision spindle attachment that mounts on wafer edge grinders (8429 machinery) to rotate and bevel wafer edges post-slicing for handling safety and yield improvement in semiconductor processing. Classified 8431.49.9020.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Reference wafer dimensions (200mm/300mm) and RPM ratings in commercial docs
• Require OEM compatibility certification for principal use determination
• Watch for reclassification to 8466 if spindle fits generic grinders