Semiconductor Wafer Edge Grinder Spindle from China
High-precision spindle attachment that mounts on wafer edge grinders (8429 machinery) to rotate and bevel wafer edges post-slicing for handling safety and yield improvement in semiconductor processing. Classified 8431.49.9020.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Reference wafer dimensions (200mm/300mm) and RPM ratings in commercial docs
• Require OEM compatibility certification for principal use determination
• Watch for reclassification to 8466 if spindle fits generic grinders