Wafer Slicing Diamond Wire Guide from Mexico
Ceramic guide pulley for diamond wire saws that slice semiconductor wafers from monocrystalline boules. Classified in HTS 8431.49.10.80 as part of heading 8426 wafer slicing equipment essential for semiconductor manufacturing.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document compatibility with multi-wire saws for 300mm wafers; declare diamond wire tension specs; ensure wear-resistant material certification for classification