Wafer Slicing Diamond Wire Guide from Japan
Ceramic guide pulley for diamond wire saws that slice semiconductor wafers from monocrystalline boules. Classified in HTS 8431.49.10.80 as part of heading 8426 wafer slicing equipment essential for semiconductor manufacturing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document compatibility with multi-wire saws for 300mm wafers; declare diamond wire tension specs; ensure wear-resistant material certification for classification