Wafer Polishing Slurry Distribution Ring from Japan
Precision-machined ring that evenly distributes chemical slurry across wafer polishers in semiconductor wafer preparation lines. Classified HTS 8431.49.10.80 as component of heading 8426 polishers critical for wafer flatness.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Certify material compatibility with CMP slurries (no copper contamination); declare hole pattern specs; ensure cleanroom packaging