8431.49.10.80/Wafer Lapping Machine Carrier Plate/Canada

Wafer Lapping Machine Carrier Plate from Canada

Thin stainless steel carrier holding individual wafers between lapping plates during simultaneous thickness reduction. Classified under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify wafer pocket diameter and thickness tolerance; declare material (316L stainless typical); track flatness specs

Wafer Lapping Machine Carrier Plate from Canada — Import Duty Rate | HTS 8431.49.10.80