Wafer Grinder Air Bearing Spindle from Japan
High-precision air bearing spindle providing vibration-free rotation for wafer grinding wheels. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor wafer grinders.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify air pressure requirements and bearing gap; declare maximum RPM; ensure cleanroom compatibility certification