Silicon Wafer Lapping Plate from Mexico
Cast iron or copper lapping plate used in semiconductor wafer grinders to achieve precise thickness uniformity before polishing. Under HTS 8431.49.10.80 as part of heading 8426 wafer preparation machinery for semiconductor fabrication.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify flatness grade (e.g
• <1μm) and wafer size compatibility; provide groove pattern documentation; condition plates before use to prevent contamination