Silicon Wafer Lapping Plate from Canada
Cast iron or copper lapping plate used in semiconductor wafer grinders to achieve precise thickness uniformity before polishing. Under HTS 8431.49.10.80 as part of heading 8426 wafer preparation machinery for semiconductor fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify flatness grade (e.g
• <1μm) and wafer size compatibility; provide groove pattern documentation; condition plates before use to prevent contamination