Semiconductor Wafer Edge Grinder Wheel Arbor from Japan
Precision spindle arbor holding diamond wheels for wafer edge profiling after slicing. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer grinder equipment.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify runout tolerance (<1μm); provide wheel diameter range; certify for high-speed rotation