Semiconductor Wafer Edge Grinder Wheel Arbor from Germany
Precision spindle arbor holding diamond wheels for wafer edge profiling after slicing. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer grinder equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify runout tolerance (<1μm); provide wheel diameter range; certify for high-speed rotation