Double-Sided Wafer Lapper Conditioning Ring from Mexico
Diamond-embedded conditioning ring used to dress lapping plates in simultaneous double-side wafer lappers. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Declare diamond grit size and distribution pattern; specify compatible plate materials; track diamond content for duty purposes