CMP Wafer Polisher Head Retaining Ring from Germany
Consumable retaining ring in chemical mechanical polishing heads that contains slurry and wafer during planarization. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer polishers.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify polymer composition and hardness rating; declare expected polish life (hours); ensure contamination-free packaging