Copper Wafer Polishing Head Component from Japan
Copper component in the polishing head assembly of 8426 wafer polishers for maintaining pressure on semiconductor wafers. Under HTS 8431.49.1070 as copper part for statistical note wafer prep equipment. Ensures dimensional tolerances for fabrication.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit assembly diagrams; copper purity tests required
• Monitor for set classification if imported with plastics
• Pitfall: incomplete machines to 8426