Copper Wafer Polishing Head Component from Japan
Copper component in the polishing head assembly of 8426 wafer polishers for maintaining pressure on semiconductor wafers. Under HTS 8431.49.1070 as copper part for statistical note wafer prep equipment. Ensures dimensional tolerances for fabrication.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Submit assembly diagrams; copper purity tests required
• Monitor for set classification if imported with plastics
• Pitfall: incomplete machines to 8426