Copper Wafer Polishing Head Component from Japan
Copper component in the polishing head assembly of 8426 wafer polishers for maintaining pressure on semiconductor wafers. Under HTS 8431.49.1070 as copper part for statistical note wafer prep equipment. Ensures dimensional tolerances for fabrication.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit assembly diagrams; copper purity tests required
• Monitor for set classification if imported with plastics
• Pitfall: incomplete machines to 8426