Of copper or copper alloys
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Of machinery of heading 8426 > Other: > Of copper or copper alloys
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.49.10.70
Copper Alloy Wafer Crystal Puller Crucible
A high-purity copper alloy crucible used in Czochralski crystal growers for pulling monocrystalline silicon boules in semiconductor wafer manufacturing. It falls under HTS 8431.49.1070 as a part of machinery of heading 8426 (semiconductor processing equipment) made of copper alloys. Essential for containing molten silicon during crystal growth.
Copper Wafer Grinding Disc
Precision copper grinding disc for crystal grinders that shape semiconductor boules to exact wafer diameters in preparation equipment. Classified under HTS 8431.49.1070 as a copper part solely for 8426 machinery used in wafer manufacturing per statistical notes. Critical for achieving conductivity-indicating flats on crystals.
Copper Alloy Wafer Slicing Saw Blade
Specialized copper alloy blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. HTS 8431.49.1070 applies as a part of 8426 wafer preparation machinery made from copper alloys. Ensures damage-free slicing for subsequent processing.
Copper Wafer Lapping Plate
Copper lapping plate for wafer grinders and lappers that achieve flatness tolerances on semiconductor wafers before fabrication. Part of 8426 machinery under HTS 8431.49.1070 due to copper construction and statistical note coverage for wafer preparation. Key for surface precision in device processing.
Copper Alloy Semiconductor Wafer Polisher Ring
Retaining ring made of copper alloy for chemical-mechanical wafer polishers in 8426 machinery, ensuring wafer edge uniformity. HTS 8431.49.1070 for copper parts dedicated to semiconductor wafer prep per chapter notes. Vital for mirror-finish surfaces required in chip fabrication.
Copper Crystal Boule Grinder Chuck
Copper chuck holder for securing semiconductor crystal boules during grinding to precise diameters in 8426 equipment. Classified HTS 8431.49.1070 as copper alloy part for wafer manufacturing crystal grinders. Features conductivity flat grinding per statistical description.
Copper Alloy Wafer Slicer Coolant Nozzle
Precision copper alloy nozzle directing coolant in wafer slicing saws of 8426 for thermal management during boule cutting. HTS 8431.49.1070 for copper parts in semiconductor wafer prep machinery. Prevents microcracks in sliced wafers.
Copper Wafer Polishing Head Component
Copper component in the polishing head assembly of 8426 wafer polishers for maintaining pressure on semiconductor wafers. Under HTS 8431.49.1070 as copper part for statistical note wafer prep equipment. Ensures dimensional tolerances for fabrication.