Copper Crystal Boule Grinder Chuck
Copper chuck holder for securing semiconductor crystal boules during grinding to precise diameters in 8426 equipment. Classified HTS 8431.49.1070 as copper alloy part for wafer manufacturing crystal grinders. Features conductivity flat grinding per statistical description.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for non-semiconductor grinders
Lack of statistical note specificity leads to Chapter 84 metalworking machines.
If other copper parts not for 8426
Specificity to heading 8426 required for .1070 subheading.
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Import Tips & Compliance
• Include blueprints showing 8426 integration; alloy certification mandatory
• Beware contamination risks—use vacuum-sealed shipping
• Pitfall: general chucks to 8466
Related Products under HTS 8431.49.10.70
Copper Alloy Wafer Crystal Puller Crucible
A high-purity copper alloy crucible used in Czochralski crystal growers for pulling monocrystalline silicon boules in semiconductor wafer manufacturing. It falls under HTS 8431.49.1070 as a part of machinery of heading 8426 (semiconductor processing equipment) made of copper alloys. Essential for containing molten silicon during crystal growth.
Copper Wafer Grinding Disc
Precision copper grinding disc for crystal grinders that shape semiconductor boules to exact wafer diameters in preparation equipment. Classified under HTS 8431.49.1070 as a copper part solely for 8426 machinery used in wafer manufacturing per statistical notes. Critical for achieving conductivity-indicating flats on crystals.
Copper Alloy Wafer Slicing Saw Blade
Specialized copper alloy blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. HTS 8431.49.1070 applies as a part of 8426 wafer preparation machinery made from copper alloys. Ensures damage-free slicing for subsequent processing.
Copper Wafer Lapping Plate
Copper lapping plate for wafer grinders and lappers that achieve flatness tolerances on semiconductor wafers before fabrication. Part of 8426 machinery under HTS 8431.49.1070 due to copper construction and statistical note coverage for wafer preparation. Key for surface precision in device processing.
Copper Alloy Semiconductor Wafer Polisher Ring
Retaining ring made of copper alloy for chemical-mechanical wafer polishers in 8426 machinery, ensuring wafer edge uniformity. HTS 8431.49.1070 for copper parts dedicated to semiconductor wafer prep per chapter notes. Vital for mirror-finish surfaces required in chip fabrication.
Copper Alloy Wafer Slicer Coolant Nozzle
Precision copper alloy nozzle directing coolant in wafer slicing saws of 8426 for thermal management during boule cutting. HTS 8431.49.1070 for copper parts in semiconductor wafer prep machinery. Prevents microcracks in sliced wafers.