Copper Wafer Lapping Plate from Mexico
Copper lapping plate for wafer grinders and lappers that achieve flatness tolerances on semiconductor wafers before fabrication. Part of 8426 machinery under HTS 8431.49.1070 due to copper construction and statistical note coverage for wafer preparation. Key for surface precision in device processing.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide flatness tolerance specs matching statistical note; include machine model compatibility
• Use ISPM-15 compliant packaging for cleanroom delivery
• Pitfall: stainless steel versions go to other subheadings