Copper Wafer Lapping Plate from Germany
Copper lapping plate for wafer grinders and lappers that achieve flatness tolerances on semiconductor wafers before fabrication. Part of 8426 machinery under HTS 8431.49.1070 due to copper construction and statistical note coverage for wafer preparation. Key for surface precision in device processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide flatness tolerance specs matching statistical note; include machine model compatibility
• Use ISPM-15 compliant packaging for cleanroom delivery
• Pitfall: stainless steel versions go to other subheadings