Copper Wafer Lapping Plate from China
Copper lapping plate for wafer grinders and lappers that achieve flatness tolerances on semiconductor wafers before fabrication. Part of 8426 machinery under HTS 8431.49.1070 due to copper construction and statistical note coverage for wafer preparation. Key for surface precision in device processing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide flatness tolerance specs matching statistical note; include machine model compatibility
• Use ISPM-15 compliant packaging for cleanroom delivery
• Pitfall: stainless steel versions go to other subheadings