Copper Wafer Grinding Disc from Japan
Precision copper grinding disc for crystal grinders that shape semiconductor boules to exact wafer diameters in preparation equipment. Classified under HTS 8431.49.1070 as a copper part solely for 8426 machinery used in wafer manufacturing per statistical notes. Critical for achieving conductivity-indicating flats on crystals.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include technical specs proving use solely with 8426 grinders; label alloy content accurately
• Obtain supplier affidavits for 'sole use' claims
• Pitfall: classifying as abrasive tools under 6804 if not machine-specific