Copper Wafer Grinding Disc from Japan
Precision copper grinding disc for crystal grinders that shape semiconductor boules to exact wafer diameters in preparation equipment. Classified under HTS 8431.49.1070 as a copper part solely for 8426 machinery used in wafer manufacturing per statistical notes. Critical for achieving conductivity-indicating flats on crystals.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include technical specs proving use solely with 8426 grinders; label alloy content accurately
• Obtain supplier affidavits for 'sole use' claims
• Pitfall: classifying as abrasive tools under 6804 if not machine-specific