Copper Wafer Grinding Disc from Japan
Precision copper grinding disc for crystal grinders that shape semiconductor boules to exact wafer diameters in preparation equipment. Classified under HTS 8431.49.1070 as a copper part solely for 8426 machinery used in wafer manufacturing per statistical notes. Critical for achieving conductivity-indicating flats on crystals.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include technical specs proving use solely with 8426 grinders; label alloy content accurately
• Obtain supplier affidavits for 'sole use' claims
• Pitfall: classifying as abrasive tools under 6804 if not machine-specific