Copper Wafer Grinding Disc from China
Precision copper grinding disc for crystal grinders that shape semiconductor boules to exact wafer diameters in preparation equipment. Classified under HTS 8431.49.1070 as a copper part solely for 8426 machinery used in wafer manufacturing per statistical notes. Critical for achieving conductivity-indicating flats on crystals.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include technical specs proving use solely with 8426 grinders; label alloy content accurately
• Obtain supplier affidavits for 'sole use' claims
• Pitfall: classifying as abrasive tools under 6804 if not machine-specific