Copper Alloy Wafer Slicing Saw Blade from Mexico
Specialized copper alloy blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. HTS 8431.49.1070 applies as a part of 8426 wafer preparation machinery made from copper alloys. Ensures damage-free slicing for subsequent processing.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document blade's diamond embedment and copper alloy specs; ensure FDA-equivalent cleanroom certification if required
• Avoid bulk import without end-use statements
• Pitfall: saw blades often misgo to 8202