Copper Alloy Wafer Slicing Saw Blade from China
Specialized copper alloy blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. HTS 8431.49.1070 applies as a part of 8426 wafer preparation machinery made from copper alloys. Ensures damage-free slicing for subsequent processing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document blade's diamond embedment and copper alloy specs; ensure FDA-equivalent cleanroom certification if required
• Avoid bulk import without end-use statements
• Pitfall: saw blades often misgo to 8202