Copper Alloy Wafer Slicing Saw Blade from Canada
Specialized copper alloy blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. HTS 8431.49.1070 applies as a part of 8426 wafer preparation machinery made from copper alloys. Ensures damage-free slicing for subsequent processing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document blade's diamond embedment and copper alloy specs; ensure FDA-equivalent cleanroom certification if required
• Avoid bulk import without end-use statements
• Pitfall: saw blades often misgo to 8202