Copper Alloy Wafer Slicer Coolant Nozzle from Japan
Precision copper alloy nozzle directing coolant in wafer slicing saws of 8426 for thermal management during boule cutting. HTS 8431.49.1070 for copper parts in semiconductor wafer prep machinery. Prevents microcracks in sliced wafers.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Prove thermal conductivity specs for classification; include flow rate data
• Cleanroom packaging essential
• Avoid: classifying as plumbing under 7412