Wire Saw Slurry Recirculation Pump Impeller from Japan
Tungsten carbide impeller for recirculation pumps in diamond wire wafer slicing saws (8426.19), handling abrasive silicon slurry. Exclusive for semiconductor machinery parts under 8431.49.1010.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include pump curve data showing semiconductor slurry specs
• Declare abrasion resistance rating for proper valuation