Wafer Polishing Pad Conditioner Disk from Japan
Diamond-embedded conditioner disk for dressing chemical mechanical polishing pads on wafer polishers (8426.30). Essential maintenance part solely for semiconductor wafer finishing machinery under 8431.49.1010.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond grit size and pad compatibility for classification proof
• Avoid 'tool' declaration shifting to 8207/8208 chapters
• Include dresser arm mounting specs