Wafer Polishing Pad Conditioner Disk from Japan
Diamond-embedded conditioner disk for dressing chemical mechanical polishing pads on wafer polishers (8426.30). Essential maintenance part solely for semiconductor wafer finishing machinery under 8431.49.1010.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond grit size and pad compatibility for classification proof
• Avoid 'tool' declaration shifting to 8207/8208 chapters
• Include dresser arm mounting specs