Wafer Polisher Head Retaining Ring from Mexico
Consumable composite retaining ring that holds wafer in place against polishing pad during CMP on 8426.30 polishers. Classified as principal wearing part for 8431.49.1010.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify material composition (PU/PPS) and groove pattern
• Distinguish from polishing pads (6804)