Wafer Polisher Head Retaining Ring from Mexico
Consumable composite retaining ring that holds wafer in place against polishing pad during CMP on 8426.30 polishers. Classified as principal wearing part for 8431.49.1010.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify material composition (PU/PPS) and groove pattern
• Distinguish from polishing pads (6804)