Wafer Lapping Machine Conditioning Ring from Japan
Cast iron or composite conditioning ring for wafer lappers (8426.30) that dresses the lapping plate surface for flatness control in semiconductor wafer preparation. Specific to machinery in 8426.11/19/30 subheadings, hence 8431.49.1010.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document ring groove patterns matching specific lapping machine models
• Avoid bulk import confusion with general machine shop rings under 8431.49.90
• Require material safety data for cast iron to meet REACH compliance