Wafer Lapping Machine Conditioning Ring from Canada
Cast iron or composite conditioning ring for wafer lappers (8426.30) that dresses the lapping plate surface for flatness control in semiconductor wafer preparation. Specific to machinery in 8426.11/19/30 subheadings, hence 8431.49.1010.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document ring groove patterns matching specific lapping machine models
• Avoid bulk import confusion with general machine shop rings under 8431.49.90
• Require material safety data for cast iron to meet REACH compliance