Wafer Grinder Vacuum Chuck from Japan
Porous ceramic vacuum chuck that holds semiconductor wafers during back grinding to ultra-thin dimensions on 8426.30 grinders. Principal part for listed machinery subheadings qualifying for 8431.49.1010.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify porosity grade for wafer size holding capability
• Include vacuum port matching to grinder spindle