Wafer Grinder Vacuum Chuck from Canada
Porous ceramic vacuum chuck that holds semiconductor wafers during back grinding to ultra-thin dimensions on 8426.30 grinders. Principal part for listed machinery subheadings qualifying for 8431.49.1010.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify porosity grade for wafer size holding capability
• Include vacuum port matching to grinder spindle