8431.39.00/Wafer Lapping Machine Platen/Canada

Wafer Lapping Machine Platen from Canada

Cast iron or composite platen for lapping semiconductor wafers to precise flatness before polishing. Part of wafer grinder/lapper/polisher under 8428 for semiconductor processing. Classified in 8431.39.00 as other parts.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify material compatibility with slurry chemicals; track flatness specs <1 micron

• Common issue: classifying as general abrasive tool parts

Wafer Lapping Machine Platen from Canada — Import Duty Rate | HTS 8431.39.00