Wafer Edge Profiling Tool from Mexico
Tooling for grinding precise edge profiles on semiconductor wafers to prevent chipping during handling. Part of wafer grinding equipment under heading 8428. Covered by 8431.39.00.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify edge geometry for 300mm wafers; cleanroom compatibility certs needed
• Common error: tool wear allowance misdeclaration