Wafer Edge Profiling Tool from Canada
Tooling for grinding precise edge profiles on semiconductor wafers to prevent chipping during handling. Part of wafer grinding equipment under heading 8428. Covered by 8431.39.00.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge geometry for 300mm wafers; cleanroom compatibility certs needed
• Common error: tool wear allowance misdeclaration