Semiconductor Wafer Slicing Diamond Saw from Germany
Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. Essential wafer preparation machinery of heading 8428. Parts thereof are 'other' under 8431.39.00.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond grit size for semiconductor kerf control in docs; BIS export control checks may apply
• Pitfall: undervaluing blades as consumables