8431.39.00/Diamond Slurry Distribution Manifold/Japan

Diamond Slurry Distribution Manifold from Japan

Manifold system that evenly distributes diamond slurry across wafer lapping/polishing platens in semiconductor prep equipment. Specific part for heading 8428 machinery. In 8431.39.00 category.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Chemical resistance certs for nano-diamond abrasives; flow rate specs required

• Avoid general plumbing classification

Diamond Slurry Distribution Manifold from Japan — Import Duty Rate | HTS 8431.39.00