Wafer Grinding Spindle Assembly from Mexico
Precision air-bearing spindle for wafer grinders ensuring sub-micron runout. Part of HTS 8431.39.0080 for heading 8428 machinery. Enables backgrinding to 50 micron thickness.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify RPM (10,000+) and runout (<0.1µm) in docs
• Avoid general bearings under 8482
• Check for export control on precision tech