8431.39.00.80/Wafer Grinding Spindle Assembly/Japan

Wafer Grinding Spindle Assembly from Japan

Precision air-bearing spindle for wafer grinders ensuring sub-micron runout. Part of HTS 8431.39.0080 for heading 8428 machinery. Enables backgrinding to 50 micron thickness.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Specify RPM (10,000+) and runout (<0.1µm) in docs

• Avoid general bearings under 8482

• Check for export control on precision tech