Wafer Grinding Spindle Assembly from Germany
Precision air-bearing spindle for wafer grinders ensuring sub-micron runout. Part of HTS 8431.39.0080 for heading 8428 machinery. Enables backgrinding to 50 micron thickness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify RPM (10,000+) and runout (<0.1µm) in docs
• Avoid general bearings under 8482
• Check for export control on precision tech