Semiconductor Crystal Grinder from China
Precision grinder for shaping crystal boules to exact wafer diameters and grinding flats indicating conductivity type. Falls under HTS 8431.39.0080 as other parts of heading 8428 wafer preparation equipment per statistical notes. Ensures precise geometry for subsequent wafer slicing.
Duty Rate — China → United States
40%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit boule processing flowcharts and tolerance specs to confirm semiconductor use
• Pitfall: general metal grinders classify under 8460
• Ensure diamond tooling declared separately if applicable