Diamond Slurry Dispenser Nozzle from Japan
Precision nozzle array for uniform diamond slurry distribution in wafer lapping machines. Part of HTS 8431.39.0080 heading 8428 equipment. Controls particle flow for consistent material removal.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document flow rate (ml/min) and orifice size specs
• Pitfall: fuel nozzles 8424.91
• Ensure wetted materials list for corrosion resistance