Diamond Slurry Dispenser Nozzle from Japan
Precision nozzle array for uniform diamond slurry distribution in wafer lapping machines. Part of HTS 8431.39.0080 heading 8428 equipment. Controls particle flow for consistent material removal.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document flow rate (ml/min) and orifice size specs
• Pitfall: fuel nozzles 8424.91
• Ensure wetted materials list for corrosion resistance