Wafer Slicing Saw Pulley Drive from Japan
Pulley and drive components for high-precision diamond saws that slice monocrystalline boules into semiconductor wafers. Falls under HTS 8431.10.00 per statistical note (a)(ii)(B) for wafer slicing saws as parts of 8425 heading machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify diamond blade compatibility and kerf thickness specs to prove wafer-specific design
• Avoid pitfall of general saw classification by providing statistical note reference in entry docs
• Pair with boule material handling proof for principal use with 8425