Wafer Slicing Saw Pulley Drive from China
Pulley and drive components for high-precision diamond saws that slice monocrystalline boules into semiconductor wafers. Falls under HTS 8431.10.00 per statistical note (a)(ii)(B) for wafer slicing saws as parts of 8425 heading machinery.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify diamond blade compatibility and kerf thickness specs to prove wafer-specific design
• Avoid pitfall of general saw classification by providing statistical note reference in entry docs
• Pair with boule material handling proof for principal use with 8425