8431.10.00/Semiconductor Wafer Lapping Hoist/Japan

Semiconductor Wafer Lapping Hoist from Japan

Lifting hoist for wafer lappers that achieve ultra-flat surfaces on sliced wafers within tight dimensional tolerances for fabrication. HTS 8431.10.00 classification aligns with statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers as 8425 parts.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document flatness specs (e.g

• <1 micron) to distinguish from general polishing equipment

• Use ISO certifications for semiconductor cleanroom compatibility