Semiconductor Wafer Lapping Hoist from Japan
Lifting hoist for wafer lappers that achieve ultra-flat surfaces on sliced wafers within tight dimensional tolerances for fabrication. HTS 8431.10.00 classification aligns with statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers as 8425 parts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flatness specs (e.g
• <1 micron) to distinguish from general polishing equipment
• Use ISO certifications for semiconductor cleanroom compatibility