Semiconductor Wafer Lapping Hoist from Germany
Lifting hoist for wafer lappers that achieve ultra-flat surfaces on sliced wafers within tight dimensional tolerances for fabrication. HTS 8431.10.00 classification aligns with statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers as 8425 parts.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document flatness specs (e.g
• <1 micron) to distinguish from general polishing equipment
• Use ISO certifications for semiconductor cleanroom compatibility