Wafer Slicing Diamond Saw Blade from Japan
Specialized diamond-impregnated saw blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. Part of wafer slicing saws in 8425 semiconductor equipment, under 8431.10.0090. Ensures minimal kerf loss and flatness for subsequent processing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
Import Tips
• Certify blade specs for <100 micron kerf in semiconductor apps; pair with 8425 saw documentation
• Pitfall: classification as generic saw under 8202 if not proven principal use