Wafer Slicing Diamond Saw Blade from Germany
Specialized diamond-impregnated saw blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. Part of wafer slicing saws in 8425 semiconductor equipment, under 8431.10.0090. Ensures minimal kerf loss and flatness for subsequent processing.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify blade specs for <100 micron kerf in semiconductor apps; pair with 8425 saw documentation
• Pitfall: classification as generic saw under 8202 if not proven principal use