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8431.10.00.90/Wafer Grinder Air Bearing Pad/Mexico

Wafer Grinder Air Bearing Pad from Mexico

Porous carbon pad providing frictionless support for wafer grinding spindles in 8425 equipment. 8431.10.0090 classification maintains <0.5 micron flatness. Critical for vibration-free surface preparation.

Duty Rate — Mexico → United States

25%

Rate breakdown

9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
9903.74.100%Articles as provided for in subdivision (k) of U.S. note 38 to this subchapter
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
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Import Tips

• Specify air permeability and load capacity; prove semiconductor tolerances

• Common error: general bearing under 8483

Wafer Grinder Air Bearing Pad from Mexico — Import Duty Rate | HTS 8431.10.00.90